Die sorting from bumped wafers to tape reel at 12,000 devices per hour.
 
Automatic tape load and tape width adjustment

Automatic calibration and drift correction

Single touch screen Graphical User Interface

2D Vision inspection for bump damage, edge chips, laser marks, surface defects and tape seal

Throughput
12,000 UPH
Footprint
1.95m2 (1.65m W x 1.16m D)
Placement Accuracy
25µm@3s
Wafer Size
300mm standard, 200mm x 12.5mm
Die Size
0.5mm x 0.5mm to 12.5mm x 12.5mm
Tape Width
8mm to 24mm



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