Londonderry, NH, April 6th, 2007 – Laurier, Inc. achieves over 30% increase in UPH on the CS1250 high speed sorter for WLCSP and other flip chip devices, from wafer to tape reel.

The CS1250 is Laurier’s answer to the market demands for an ultra high speed system for tape reel processing. The CS1250 can now transfer die to tape reel at more than 16,000 parts per hour, while performing full inspection at every step of the process. Laurier’s newest die sorter platform is the fastest chip to tape reel machine in the industry.

“Several breakthroughs in technology have enabled the throughput increase of over 30%”, explains Scott Evans, Die Sorter Product Manager. “Die placements of 16,000 per hour is not the sprint rate, it’s the actual taping speed”. This includes full inspection of the device before picking, after flipping, in pocket, and post cover tape seal. We have run this process with WLPs as small as 1.13 mmx 1.77 mm. The average UPH was 16,050 into 8mm tape with a 4mm pitch and pressure seal cover tape.

CS1250 features include 4 point vision inspection, real time wafer map status, touch screen, automatic calibration and auto tape load. The standard system handles 300mm wafers. Characterized by ease-of-use, low maintenance requirements, quick changeover and ultra-high throughput the CS1250 offers the best value and lowest cost of ownership in the industry.